More details emerge on the Intel/TSCM deal and Moorestown

A new rumor in the Chinese-language Commercial Times, picked up by DigiTimes, indicates that Intel will use some intellectual property from its new foundry partner, TSMC, to fill out its upcoming ultramobile chipset, codenamed Langwell. This rumor, which I suspect is true, may provide the answers to long-standing questions about two different aspects of Intel’s plans for Atom and its derivatives. But, before we get to the questions, let’s talk about Langwell.

Langwell is the southbridge (or I/O hub) for Intel’s forthcoming Atom successor, codenamed Moorestown. Above is a block diagram of Moorestown that shows the platform’s two main components: the SoC, codenamed Lincroft, and the I/O hub, codenamed Langwell.

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